Introduction
The C2, developed by SZ DJI TECHNOLOGY and bearing model number GL200A1606, represents a sophisticated wireless communication module designed for integration into advanced electronic systems, such as drone controllers or telemetry units. As with many of DJI’s high-performance products, the C2 is engineered for reliability, robust wireless connectivity, and seamless integration within demanding RF environments.
A critical milestone for any RF-enabled device entering the US market is compliance with Federal Communications Commission (FCC) regulations. The C2 has been certified under FCC ID SS3-GL200A1606 (grant date: None), signifying that it meets stringent US standards for electromagnetic emissions and interference. This certification ensures the device is legal to sell and operate, providing confidence to manufacturers, integrators, and end users that the C2 will function as intended without violating RF exposure or EMC limits.
In this comprehensive analysis, we delve into the C2’s key features and specifications, examine its wireless operating frequencies, explore the underlying technology, and provide an expert teardown of its internal components. We also discuss its FCC regulatory status and outline potential use cases—offering a complete picture for engineers, tech enthusiasts, and anyone interested in state-of-the-art wireless modules.
Key Features & Specifications
While official, detailed specifications for the C2 (GL200A1606) are limited in the public domain, a thorough analysis of available FCC filings and internal photographs reveals a device designed for high-reliability wireless communication in compact, performance-driven applications. Here’s a consolidated overview of its likely features and technical attributes:
- Manufacturer: SZ DJI TECHNOLOGY
- Product Name: C2
- Model Number: GL200A1606
- FCC Certification: FCC ID SS3-GL200A1606
- Device Type: High-performance wireless communication module (likely for drone controllers or telemetry)
- Primary Functions:
- Secure, low-latency wireless data transmission
- RF communication in ISM bands (2.4 GHz)
- Power management and robust EMI/RFI shielding
- Modular integration with other electronic systems
- Build & Design:
- Multi-layer PCB (at least 4-6 layers), supporting complex signal routing and ground planes for RF integrity
- Dense SMD component placement for compactness and high reliability
- Extensive EMI/RFI shielding with custom-shaped metal cans and heatsinks
- Robust grounding strategies including via stitching and ground pours
- Gold-plated connectors and mounting holes for durability and signal quality
- Connectivity:
- Likely supports Wi-Fi (2.4 GHz bands), Bluetooth, and/or proprietary DJI wireless protocols
- Fine-pitch FPC/FFC connectors enabling modular expansion (e.g., antennas, cameras, sensors)
- USB Type-C connectivity for charging, data transfer, or firmware upgrades
- Power Management:
- Integrated DC-DC converters with local regulation and filtering
- On-board inductors, capacitors, and power management ICs for efficient operation
- User Interface:
- Tactile switches for reset or pairing
- Status LEDs and test points for diagnostics (inferred from standard DJI designs)
- Mechanical & Thermal Design:
- Custom heatsinks for critical ICs, ensuring reliable operation under high load
- Precision SMD soldering and modular assembly for serviceability
Benefits and Practical Implications:
- High Reliability: The C2’s multi-layer PCB and meticulous RF shielding minimize interference, ensuring stable operation even in noisy environments—a must for mission-critical drone or robotics applications.
- Compact Integration: Its dense, modular design enables seamless integration into space-constrained devices without sacrificing performance.
- Regulatory Compliance: Full adherence to FCC emission standards (FCC ID SS3-GL200A1606) guarantees legal operation in the US and minimizes the risk of RF-related issues during deployment.
Typical Expectations for This Device Class:
For products like the C2, users expect robust wireless range, low latency, secure data links, and reliable operation in challenging RF environments. These modules are often the backbone of remote controllers, telemetry systems, or smart robotics—where performance and compliance are non-negotiable.
Operating Frequencies
The C2 by SZ DJI TECHNOLOGY, as documented in its FCC filing, operates across the following key frequencies:
Frequency Range (GHz) | Output Power (mW) | FCC Rule Part |
---|---|---|
2.4035-2.4775 | 750 | 15C12.4055 |
2.4725 | 918 | 15C3 |
2.4775 | 242 | 15C22.4105 |
Key Takeaways:
- 2.4 GHz ISM Band: The C2’s primary operation in the 2.4 GHz spectrum aligns with global standards for Wi-Fi, Bluetooth, and proprietary low-power RF communications.
- Variable Output Power: With output power peaking at 918 mW, the C2 is capable of establishing strong, long-range wireless links—crucial for drone controllers or telemetry units operating in open or interference-prone environments.
- Regulatory Compliance: The device’s operation under multiple FCC rule parts underscores its flexibility and compliance with US spectrum regulations.
Understanding these frequency bands and power levels is essential when assessing the C2’s wireless capabilities, potential range, and ability to coexist with other RF devices.
Technology Deep Dive
The C2’s wireless technology foundation is built upon advanced RF design principles, leveraging the 2.4 GHz ISM band—a universally adopted spectrum for high-throughput, low-latency communication. While the equipment class is not explicitly defined, the internal architecture (as revealed by FCC imagery) suggests support for Wi-Fi, Bluetooth, and potentially proprietary DJI protocols.
Performance and Range:
Operating in the 2.4 GHz band allows the C2 to balance range and data throughput, making it ideal for real-time control and video transmission. Higher output power enhances link reliability, especially in cluttered or outdoor settings, while advanced EMI/RFI shielding ensures minimal susceptibility to interference from co-located wireless devices.
Interference and Power Consumption:
The dense shielding and multi-layer PCB design reflect a focus on minimizing self-interference and external RF noise, critical for stable operation in environments crowded with wireless signals (e.g., drone swarms, urban areas). The use of local power regulation circuits and efficient DC-DC converters helps manage power draw, extending operational life in portable scenarios.
Insights from Test Reports:
While detailed test reports are not directly referenced here, FCC filings typically confirm that the C2 passes rigorous assessments for RF exposure, electromagnetic compatibility, and spurious emissions—further underscoring its suitability for professional and consumer deployment.
In-Depth Internal Component Analysis / Teardown
Main RF & Processing Section with Custom Shielding
A densely populated PCB section is revealed, dominated by a major integrated circuit partially obscured by a custom-shaped metal shield. This shielded area likely houses the primary RF transceiver or a Wi-Fi/Bluetooth system-on-chip, crucial for the module’s wireless communication capabilities. Numerous smaller ICs flank the main component, supporting power management and signal conditioning. The board’s dark soldermask and high via density indicate a multi-layer construction, optimized for signal integrity and robust grounding. Extensive EMI/RFI shielding and precise SMD placement reflect a design focused on minimizing interference and maximizing reliability in demanding RF environments.
High-Density PCB with Modular Connectors
This section of the PCB showcases several ICs in QFN and BGA packages, with multiple shielded zones indicating the presence of sensitive RF front-ends and transceivers. The layout reveals fine-pitch FPC/FFC connectors, enabling modular expansion with external components such as antennas or sensors. Differential pair routing and controlled impedance traces underscore the board’s suitability for high-frequency signals, while large ground pours and copious vias provide excellent grounding for EMI control. The inclusion of crystals and oscillators further supports precise timing critical to RF communication, and the overall assembly exudes the hallmarks of high-end, serviceable electronics.
Shielded Communication and Power Management Core
A compact, multi-layer PCB segment is dominated by large, perforated metal shield cans, protecting critical ICs—likely including RF transceivers and the main system controller. The visible FPC/FFC connector allows for flexible inter-module connectivity, while numerous power passives (inductors, capacitors) cluster around shielded areas, pointing to sophisticated local power regulation. The presence of a crystal oscillator provides stable timing for the RF or digital subsystems. This section exemplifies DJI’s commitment to EMI control, modularity, and reliability in high-frequency designs.
Thermal Management and Main Processing Zone
Here, the PCB is equipped with both a large metal shield and a custom heatsink—indicative of significant thermal output from the underlying ICs, likely the main SoC or RF chips. The board’s multi-layer construction is evident through numerous vias and gold-plated mounting holes, ensuring both mechanical stability and optimal grounding. The combination of robust shielding and targeted thermal management allows the C2 to maintain high performance under sustained loads, a necessity for continuous wireless operation in professional-grade devices.
USB-C Connectivity and External Interface Section
A more moderately populated PCB region reveals a prominently mounted USB Type-C connector, supporting charging, data transfer, or firmware updates. Surrounding this connector are several small ICs, likely power management or logic components, and a tactile switch for user interaction (reset/pairing). The presence of a circular cutout and possible antenna feed point hints at provisions for external RF connectivity. Multiple gold-plated test points and excellent soldering quality reinforce the device’s focus on manufacturability and diagnostics.
Power Regulation and RF Front-End Detail
This close-up highlights a section rich in passive components—inductors, capacitors, and fine gold-plated traces—suggesting a focus on power regulation or RF front-end circuitry. A metal shield can covers sensitive areas, while controlled-impedance traces and via stitching demonstrate meticulous attention to EMI suppression and signal fidelity. The visible connector segment likely facilitates board-to-board communication, further supporting the C2’s modular architecture. Overall, this area exemplifies high-quality PCB design practices tailored for stable RF performance.
Regulatory Insights & FCC Filing
The FCC ID SS3-GL200A1606 assigned to the C2 by SZ DJI TECHNOLOGY is a definitive marker of the device’s compliance with US electromagnetic interference and RF emission standards. This certification, as registered on FCC.gov (grant date: None), is vital for legal sale, distribution, and operation within the United States.
FCC filings for such devices typically encompass a wealth of technical documentation, including:
- RF Exposure Reports: Verifying that emissions are within safe limits for users and bystanders.
- Electromagnetic Compatibility (EMC) Test Results: Ensuring the device does not interfere with other electronic equipment.
- Internal and External Photographs: Providing transparency into the device’s construction and confirming the presence of required shielding.
- User Manuals: Outlining safe and proper operation, maintenance, and setup procedures.
- Schematics and Block Diagrams: Demonstrating the internal circuit design and signal flow for regulatory review.
By achieving FCC certification under SS3-GL200A1606, the C2 assures integrators and end-users of its adherence to all relevant US regulatory requirements, minimizing the risk of compliance issues and facilitating smooth market entry.
Potential Use Cases & Target Audience
Although no explicit target audience is defined, the C2’s technical attributes and robust wireless capabilities lend themselves to several practical scenarios:
- Professional Drone Controllers: The C2 is ideally suited for integration into advanced drone remote controllers, providing secure, long-range wireless communication and real-time telemetry—critical for both commercial and industrial UAV operations.
- Wireless Telemetry Modules: Engineers and developers can leverage the C2 as a core component in custom telemetry solutions for robotics, unmanned vehicles, or IoT gateways, where reliable RF performance is paramount.
- Embedded Communication Systems: The device’s modularity, USB-C connectivity, and strong EMI/RFI design make it a prime candidate for high-end embedded systems requiring seamless wireless data exchange, such as in smart agriculture, surveying, or industrial automation.
These scenarios highlight the C2’s versatility and appeal to a technically savvy audience seeking reliable, high-performance wireless modules for demanding applications.
Conclusion
The C2 by SZ DJI TECHNOLOGY (Model: GL200A1606), certified under FCC ID SS3-GL200A1606, stands out as a meticulously engineered wireless communication module. Its advanced PCB design, robust EMI/RFI shielding, and comprehensive power management underscore its suitability for mission-critical applications like drone control and telemetry. FCC certification not only affirms its legal status in the US market but also guarantees adherence to stringent RF and EMC standards. For engineers and integrators seeking a reliable, high-performance wireless solution, the C2 represents a compelling blend of regulatory compliance, technological sophistication, and practical versatility.